晶片新创公司 Kepler Computing 结束长达七年的隐形模式，宣布开发出一种新型高频宽记忆体（HBM）与 SRAM 架构。该技术利用创新的 3D 堆叠及专利铁电复合材料，完全无需依赖昂贵且供不应求的极紫外光（EUV）微影设备，即可在现有晶圆厂中实现相当于 2 至 3 奈米晶片的储存密度，期望以此缓解全球记忆体晶片短缺问题。

目前该公司已获得来自 GlobalFoundries、Intel Capital、AMD Ventures、Baillie Gifford 及比尔·盖兹等知名投资者共计 4.68 亿美元的资金，并获得美国商务部高达 2.45 亿美元的支持承诺。Kepler 主要与 GlobalFoundries 合作，在新加坡及美国厂区利用 28 奈米制程建立「迷你晶圆厂」，将原本需要 24 个月的晶圆厂改造周期缩短至 8 个月，显著降低新建晶圆厂的高昂成本与时间。

尽管技术具有突破性，Kepler 面临的核心挑战仍在于如何实现大规模量产。该技术所采用的特殊铁电材料含有铁等潜在污染物，必须严格隔离或在专用设备上运行以避免产线污染。公司计划于今年稍晚交付首批 HBM 样品，并预计在 2028 年将晶片生产推进至美国本土，但最终成效仍取决于能否在成千上万片晶圆上保持稳定的良率与品质标准。

Chip startup Kepler Computing has emerged from seven years in stealth mode, unveiling a new architecture for high-bandwidth memory (HBM) and SRAM. By leveraging a novel 3D stacking approach and proprietary ferroelectric composite materials, the startup achieves storage densities comparable to 2nm or 3nm chips without relying on expensive extreme ultraviolet (EUV) lithography, aiming to ease the global memory chip shortage within existing fabs.

The company has raised $468 million from high-profile backers including GlobalFoundries, Intel Capital, AMD Ventures, Baillie Gifford, and Bill Gates, alongside a commitment of up to $245 million from the US Department of Commerce. Partnering closely with GlobalFoundries, Kepler has built 'mini fabs' in Singapore and the US to produce its memory chips alongside 28-nanometer wafers, converting facilities in just eight months and bypassing the tens of billions required for new fabs.

Despite its theoretical breakthroughs, Kepler faces significant hurdles in scaling production across thousands of wafers. Its composite material contains iron, a challenging contaminant in semiconductor fabrication that requires dedicated equipment and rigorous isolation to prevent cross-contamination. While Kepler plans to sample its first HBM chips later this year and initiate US production by 2028, proving reliable high-volume manufacturing remains its ultimate test.