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长鑫存储(CXMT)正迅速崛起为全球最重要的半导体制造商之一,计划下周以CXMT Corp.名义进行中国2026年最大规模IPO,筹资逾43亿美元。该公司今年上半年营收增长七倍,领跑整个行业,并计划在年底前将产能翻倍,打造从晶片设计到封装测试的完整供应链,最终目标是挑战SK海力士、三星和美光三大记忆体巨头的市场地位。

CXMT围绕自身建立了一张由极星拓方(Cublazer)、TSFC半导体和芯测科技(Xyxtech)等关联企业组成的隐秘供应网络,分别负责高频宽记忆体设计、晶圆制造及测试封装,这一模式与华为的供应链策略如出一辙。公司还透过购买ASML翻新光刻机、自主研发制造工艺、大量从海外高薪招揽工程师等方式规避美国出口管制。尽管已被五角大楼列入黑名单,但CXMT尚未被列入商务部实体清单,因此仍保有一定的设备获取管道。

创办人朱一明自2004年起便怀抱在中国建立记忆体晶片帝国的愿景,从矽谷车库创业到创立兆易创新,再到2017年在合肥破土建设CXMT首座工厂。在全球记忆体晶片短缺预计持续至2027年的背景下,CXMT已跃居全球记忆体晶片市场第四大供应商,2025年营收超过610亿元人民币。公司计划将约300亿元IPO募资投入技术升级和研发,力争在年底前启动HBM3E量产,尽管其韩美对手已领先两年并开始转向下一代HBM4。

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ChangXin Memory Technologies (CXMT) is rapidly emerging as a pivotal force in the global semiconductor industry, planning China's largest IPO of 2026 next week to raise over $4.3 billion. With revenue growing seven-fold in the first half of the year, the company aims to double output by year-end and build a vertically integrated supply chain encompassing chip design, manufacturing, testing, and packaging — ultimately challenging memory-chip giants SK Hynix, Samsung, and Micron.

CXMT has constructed a covert network of affiliated suppliers — Cublazer for HBM design, TSFC Semiconductors for wafer fabrication, and Xyxtech for testing and packaging — mirroring Huawei's strategy of reducing foreign dependence. To circumvent US export controls, the company relies on refurbished ASML lithography machines, develops proprietary manufacturing techniques, and aggressively recruits engineers from abroad with premium compensation packages. While blacklisted by the Pentagon, CXMT has avoided the Commerce Department's more devastating Entity List, preserving its access to critical foreign equipment.

Founded by US-trained chip veteran Zhu Yiming, whose vision of a Chinese memory-chip empire dates back to 2004, CXMT has grown from its Hefei base into a nearly 20,000-employee operation and the world's fourth-largest memory-chip supplier, with 2025 revenue exceeding 61 billion yuan. Amid a global memory shortage expected to persist through 2027, the company plans to invest roughly 30 billion yuan from its IPO proceeds into R&D and technology upgrades, targeting HBM3E mass production by year-end — though it remains two years behind its Korean and American rivals, who have already advanced to HBM4.
2026-07-12 (Sunday) · 895fe64317d7dde6b633e40b204b6c0392579c54