马斯克表示，特斯拉需要在未来三到四年内建设并运营一座自有半导体工厂“Terafab”，以消除芯片供应瓶颈。这座工厂将覆盖逻辑芯片、存储器和封装，预计耗资数十亿美元。特斯拉目前依赖三星电子、台积电和美光供应芯片，但马斯克称这些供应商无法满足其在人工智能、自动驾驶和机器人领域不断增长的需求。

芯片供应被视为特斯拉中长期增长的关键约束。马斯克警告，如果不自建晶圆厂，公司将“撞上芯片墙”，并强调全球对台积电的高度依赖放大了地缘政治风险。建设先进晶圆厂需要高昂的固定成本、漫长的建设周期以及关键设备投入，其中包括来自ASML的核心光刻设备，行业门槛极高。

在财务层面，特斯拉预计今年资本支出将超过200亿美元，同时账面持有约440亿美元现金和投资。首席财务官表示，公司可依靠内部资源并结合银行融资，通过债务或其他方式为晶圆厂项目筹资。尽管工厂选址和时间表尚不明确，马斯克称未来将就Terafab发布“更大的公告”，显示特斯拉正加速推进垂直整合战略。

Elon Musk said Tesla needs to build and operate its own semiconductor factory, dubbed a “Terafab,” within three to four years to remove looming chip constraints. The facility would produce logic, memory, and packaging, and is expected to cost billions of dollars. Tesla currently sources chips from Samsung Electronics, Taiwan Semiconductor Manufacturing Co., and Micron Technology, but Musk said existing suppliers cannot meet the scale required for Tesla’s AI, autonomous driving, and robotics ambitions.

Chip supply is a critical medium-term bottleneck. Musk warned Tesla would “hit a chip wall” without its own fab and highlighted heavy global dependence on TSMC as a growing geopolitical risk. Constructing a leading-edge fab entails tens of billions of dollars in fixed costs, long timelines, and reliance on complex equipment, including ASML’s advanced lithography tools, underscoring the industry’s high barriers to entry.

Financially, Tesla expects capital expenditures to exceed $20 billion this year and holds about $44 billion in cash and investments. The chief financial officer said the company can fund projects using internal resources and bank financing, potentially through additional debt or other structures. While the fab’s location and schedule remain unclear, Musk said a “bigger announcement” on Terafab will come later, signaling an ускорated push toward vertical integration.