除了晶片堆叠，华为还开发了 CloudMatrix 384 平台，透过电信网路技术将数百个AI处理器连结为运算集群，以规模优势弥补单一晶片效能的不足，挑战辉达（Nvidia）的主导地位。这促使中国本土科技企业对国产AI晶片的需求急遽上升，但中芯国际（SMIC）的产能瓶颈仍是主要挑战。
华为的重振不仅向投资者和工程师证明了中国实现半导体自主的可行性，也开始向中东及中亚市场销售结合自身晶片与 DeepSeek 模型的系统。尽管面临功耗和良率等技术难题，华为的举措正对美国的科技霸权构成显著挑战。
In response to the US semiconductor export controls imposed since 2019, Huawei's HiSilicon head, He Tingbo, led a decade-long preparation for an extreme survival scenario. In 2026, Huawei unveiled a logic-stacking technology to boost chip performance without relying on ASML's advanced EUV lithography machines, breaking the narrative that China's chip development would freeze at the 7nm limit.
Beyond chip stacking, Huawei developed the CloudMatrix 384 platform, linking hundreds of AI processors into a powerful computing cluster to compensate for individual chip weaknesses, aiming to challenge Nvidia's dominance. This has driven a surge in domestic demand for Chinese AI chips, though manufacturing capacity constraints at SMIC remain a significant bottleneck.
Huawei's comeback has convinced investors and engineers that Chinese semiconductor independence is achievable, and the company has begun marketing AI systems combined with DeepSeek models to the Middle East and Central Asia. Despite challenges in power consumption and yields, Huawei's progress poses a significant challenge to US technology dominance.