英偉達本週公佈了全新 Vera Rubin 晶片系統的效能基準，該系統由 Vera CPU 與 Rubin GPU 組合而成。公司高層在聖克拉拉總部的技術研討會上向記者展示了該系統在功耗與效能方面的提升，並強調英偉達正從單純的 GPU 供應商轉型為完整 AI 系統供應商，以應對業界對能驅動 AI 代理的 CPU 日益增長的需求。

Vera Rubin NVL72 系統每瓦可處理的 token 數量是前代 Grace Blackwell 的十倍，記憶體頻寬也提升近三倍。該系統採用全液冷設計，大幅減少機架間連接線纜數量，實現所謂「無線纜運算」與「熱插拔」功能，將機架安裝時間從數小時縮短至數分鐘。OpenAI 已率先部署了一組 Vera Rubin 機架。

英偉達計劃於今年下半年全面量產 Vera Rubin，早期客戶包括微軟、OpenAI 和甲骨文。該產品發佈正值競爭對手 AMD 年度大會前夕，AMD 也推出了對標的 Helios AI 晶片機架。值得注意的是，英偉達此次在 CPU 架構上捨棄了業界常見的小晶片設計，改用單片式晶片，以提升資料傳輸效率與記憶體頻寬表現。

Nvidia unveiled its new Vera Rubin chip system this week, showcasing performance benchmarks for the GPU-CPU combination ahead of AMD's annual event. Company executives highlighted Nvidia's strategic shift from being primarily a GPU supplier to offering complete AI systems, driven by the growing need for CPUs capable of orchestrating agentic AI workloads, data flows, and networking tasks.

The Vera Rubin NVL72 system delivers ten times the tokens per watt compared to the previous Grace Blackwell generation and nearly triples memory bandwidth. Featuring fully liquid-cooled, cable-free compute with hot-swappable racks, installation time drops from hours to minutes. OpenAI has already deployed a Vera Rubin rack, and Nvidia plans full production in the second half of this year with early customers including Microsoft, OpenAI, and Oracle.

Nvidia's Vera Rubin launch comes just before AMD's annual conference, where AMD revealed its competing Helios AI chip rack. Notably, Nvidia adopted a monolithic chip design for the Vera CPU rather than the chiplet architecture favored by AMD and others, arguing that a single integrated circuit avoids the memory bandwidth and data movement penalties imposed by stitching together multiple chiplets.