Huawei Technologies Co. 表示，正寻找新路径缩小与 Taiwan Semiconductor Manufacturing Co. 的差距；目前双方在先进制程能力上约有 5 年落差。Huawei 半导体主管 He Tingbo 称，Huawei 将以自家 “LogicFolding” 技术在 2031 年开始制造 1.4 奈米晶片，而 TSMC 已表示将于 2028 年量产同一制程。He 并称，该架构可在不使用 ASML Holding NV 的极紫外光（EUV）设备下推进晶片制造，这被视为突破传统产线限制的关键。
He 表示，首批采用 LogicFolding 的将是今年秋季推出的 Kirin 行动晶片；其原理是增加电晶体数量并优化资料传输速度，以提升效能。她还说，团队已提出可持续演进的方案，并以 Huawei 自家的 Tau Scaling Law 挑战 Moore’s Law。He 指出，Huawei 在过去 6 年已基于 Tau Scaling Law 设计并制造 381 颗晶片；自美国出口管制冲击后，依 Moore’s Law 的扩展努力在 6 年前已达平台期。
市场反应迅速：上海 Star 50 Index 盘中创新高，SMIC 股价一度大涨超过 18%，Hua Hong Semiconductor 触及 20% 日涨停。若 Huawei 真能大量生产 1.4 奈米晶片，将挑战业界认为 5 奈米或更先进制程必须依赖 ASML EUV 的共识。文章同时指出，Huawei 先前已申请涉及 SAQP 的专利，并在 9 月公布 3 年 AI 晶片路线图，试图填补 Nvidia 在中国市场留下的空缺。
Huawei Technologies Co. said it is seeking a new path to narrow its gap with Taiwan Semiconductor Manufacturing Co.; the current gap in advanced process capability is about five years. Huawei semiconductor chief He Tingbo said Huawei will begin making 1.4-nanometer chips in 2031 with its own “LogicFolding” technology, while TSMC has said it will start mass production of the same node in 2028. He also said the architecture could advance chipmaking without ASML Holding NV’s extreme ultraviolet (EUV) tools, which are widely viewed as critical to cutting-edge production.
He said the first chips to adopt LogicFolding will be the Kirin mobile chips scheduled for launch this fall; the architecture is designed to raise performance by increasing transistor count and improving data transmission speed. She also said the team has found a sustainable evolution path and is using Huawei’s Tau Scaling Law to challenge Moore’s Law. He said Huawei has designed and made 381 chips over the past six years based on Tau Scaling Law; its scaling efforts under Moore’s Law reached a plateau six years ago after U.S. export controls.
Markets reacted sharply: Shanghai’s Star 50 Index hit a record after the announcement, SMIC rose more than 18%, and Hua Hong Semiconductor touched the 20% daily limit. If Huawei can mass-produce 1.4-nanometer chips, it would defy the industry consensus that ASML EUV machines are necessary for chips at 5nm or more advanced. The article also notes Huawei’s earlier SAQP patent filings and its September three-year AI-chip roadmap aimed at filling the gap left by Nvidia in China.