日本的Rapidus计划于2027财年在北海道启动第二座晶圆厂建设，并在2029年最早开始量产1.4奈米晶片，其投产时程较TSMC的2028年计划仅落后约1年。整体专案投资额预估为数兆日圆，其中第二厂投资额单独即超过2兆日圆，而政府将提供数千亿日圆的研发初期资助并提供贷款担保。Rapidus在千岁的第一厂预定于2027财年下半年量产2奈米产品，同时提前启动第二厂，以在2奈米尚未成熟前就向1.4奈米与1奈米节点推进。

公司将于2026财年开始1.4奈米的全面研发，并延续与IBM在2奈米技术上的合作。虽然Rapidus已于7月确认2奈米装置能运作，但尚未建立量产路线。公司视设定1.4奈米以下节点的量产目标为确保长期客户的关键策略。由于线宽缩小能带来更高效能与能效，1.4奈米产品被定位为资料中心、机器人、自驾车与智慧型手机等高科技领域的核心元件。

全球晶片制造商正加速在线宽缩小上竞争：TSMC目标于今年量产2奈米、2028年量产1.4奈米；三星则计划于2027年量产1.4奈米。Rapidus 2029年的投产意味著必须迅速拉升量产规模，以避免进一步落后。然而三星与Intel目前在先进节点的良率改善上遇到困难，显示Rapidus在进入1.4奈米与更小节点时亦可能面临相同挑战。

Japan’s Rapidus plans to begin construction of a second fab in Hokkaido in fiscal 2027 and start 1.4-nm chip production as early as 2029, trailing TSMC’s 2028 target by roughly one year. Total investment is estimated at several trillion yen, with the second plant alone exceeding 2 trillion yen. The government will supply hundreds of billions of yen in initial R&D funding and guarantee bank loans. At its first Chitose plant, Rapidus aims for mass production of 2-nm chips in the latter half of fiscal 2027, while accelerating work on the second plant to advance toward 1.4-nm and potentially 1-nm nodes before 2-nm output fully matures.

Full-scale R&D on 1.4-nm chips will begin in fiscal 2026, alongside continued collaboration with IBM on 2-nm technology. Although a functioning 2-nm device was verified in July, no mass-production pathway exists. Setting targets below 1.4 nm is intended to secure long-term customers. Because shrinking circuit width increases performance and energy efficiency, 1.4-nm chips are expected to serve as key components in data centers, robotics, autonomous vehicles, and smartphones.

Global chipmakers are racing to reduce node size: TSMC seeks 2-nm mass production this year and 1.4-nm in 2028, while Samsung targets 1.4-nm in 2027. With production starting in 2029, Rapidus must scale quickly to remain competitive. Reported yield struggles at Samsung and Intel indicate that Rapidus will likely face similar challenges at leading-edge nodes.